Cumyl Peroxyneodecanoate CPND Percumyl ND CAS 26748-47-0

Tree Chem manufactures Cumyl Peroxyneodecanoate (CPND) with advanced peroxide synthesis technology, ensuring low impurities and reliable active oxygen content. The product demonstrates excellent compatibility in various polymer systems and performs well under medium-temperature polymerization and crosslinking processes.

It is suitable for unsaturated polyester resin, acrylate, and styrene polymerization, providing efficient initiation with clean decomposition characteristics. Tree Chem offers flexible supply in 20 kg polyethylene drums or tailored packaging formats upon request. For technical support, please reach rocket@cntreechem.com.

Specification

Basic Information

Technical Specification

Applications

Cumyl Peroxyneodecanoate (CIPP or CNP) is a key organic peroxide initiator that plays an irreplaceable role in the global polymer materials industry. With its molecular formula C₁₉H₃₀O₃ and molecular weight of 306.44, CIPP is a colorless transparent liquid known for its optimal half-life temperature range of 80–110 °C, ensuring efficient radical generation without excessive exotherm or runaway polymerization. Compared with benzoyl peroxide, it offers longer pot life, better storage stability, and lower volatility, making it ideal for high-clarity and color-sensitive resin systems.

PVC Polymerization:

• CIPP dominates the PVC sector as one of the most efficient low-temperature initiators. It enables high conversion rates, uniform particle size, and reduced fouling during suspension and emulsion polymerization. The initiator works effectively at 40–60 °C and is often used in combination with di-(2-ethylhexyl) peroxydicarbonate (EHP) at ratios of 1:3–1:4, diluted to 5–15 % with water and stabilized by PVA solutions. Such blends ensure smooth polymerization, even heat release, and improved safety in large-scale continuous operations.

Rubber Vulcanization:

• In elastomer cross-linking, CIPP serves as a low-temperature peroxide curing agent suitable for EPDM, NBR, HNBR, and silicone rubber. It provides superior heat and chemical resistance compared to sulfur vulcanization. However, because of its relatively low decomposition temperature (38–75 °C), it is mainly used for low-temperature or auxiliary curing formulations.

Coatings and Unsaturated Polyester Resins:

• CIPP delivers high efficiency in curing unsaturated polyester resins (UPR) and thermosetting coatings. It generates radicals at moderate or even ambient temperatures, reducing residual monomers while enhancing gloss and mechanical strength. Typical formulations combine 100 parts UPR with 1–3 % CIPP and 0.5–3 % cobalt naphthenate as a promoter, achieving fast and complete cure. In advanced composites, its low-temperature decomposition improves surface quality and transparency.

New Energy Materials:

• The use of CIPP has expanded rapidly in photovoltaic (PV) materials. In EVA encapsulant films for solar cells, CIPP acts as a crosslinking agent at 0.3–1.0 parts per 100 parts EVA. It ensures uniform crosslink density, high transparency, and long-term stability. Blends of CIPP with other peroxides—such as bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane or tert-butyl peroxycarbonates—allow precise control of curing kinetics and mechanical properties. The technology is also applied to battery insulation, charging system materials, and other energy storage components.

Other Polymer Fields:

• Beyond PVC and EVA, CIPP is also employed in LDPE (130–170 °C high-pressure polymerization) and PS polymerization for high optical transparency. Its volatile and low-residue decomposition behavior ensures colorless, odor-free resins suited for optical-grade and specialty plastics.

Storage & Handling

• Store in a cool, dry, ventilated place, away from sunlight and heat.
• Keep containers sealed; avoid contamination with acids, alkalis, or reducing agents.
• Handle with grounded non-sparking tools and maintain temperature control.
• Follow applicable organic peroxide storage standards for safety.

Usage Notice

• Operate by trained personnel only.
• Avoid contact with combustible materials and heat sources.
• In case of leakage, absorb with inert materials and rinse with water.
• Dispose of residues in accordance with hazardous waste regulations.
• PVC Suspension Polymerization: CIPP 10–20 parts + EHP 80–90 parts; operate at 40–60 °C for stable conversion and uniform particle size.
• PVC Industrial Blend System: CIPP/EHP = 1:3 ratio diluted to 10 % with water and PVA (2–4 %) as protective colloid to prevent coagulation.
• Multicomponent PVC Initiator System: CIPP (40 % solution) 10–15 parts + t-butyl peroxyneodecanoate 5–10 parts + di-n-octyl peroxydicarbonate 5–10 parts + bis(3,5,5-trimethylhexanoyl) peroxide 20–25 parts to balance activation and heat control.
• Unsaturated Polyester Resin System: CIPP 1–3 % (on resin weight) + cobalt naphthenate 0.5–3 % as accelerator for rapid curing and high conversion at room temperature.
• Rubber Vulcanization Reference: CIPP 2–5 phr used with 0.1–5 phr TMTD and 0.05–2.5 phr MBT for EPDM and HNBR systems to enhance crosslink density and thermal stability.
• EVA Solar Encapsulant Film: EVA 100 parts + CIPP 0.4–0.9 parts + co-crosslinker 0.5–0.9 parts + antioxidant 0.1 part + UV absorber 0.1–0.3 part; crosslink at 130–150 °C to achieve optical clarity and anti-PID stability.
• Co-Initiation System for PVC and Vinyl Monomers: CIPP C60 (60 % solution, active oxygen 3.1 %) combined with peroxydicarbonate initiators to widen the processing window and reduce viscosity fluctuations.

Packaging

• 20 kg polyethylene drums
• Custom packaging available upon request