Diisobutyryl Peroxide DIBP CAS 3437-84-1

Tree Chem manufactures Diisobutyryl Peroxide under strict safety and quality systems, ensuring uniform peroxide activity and controlled hydrolysable chloride levels. Its emulsion form offers easy dispersion, excellent storage stability, and compatibility with most polymer systems.

This product is suitable for industrial applications requiring medium-temperature initiation, including acrylic, vinyl, and unsaturated polyester systems. With flexible 20 kg polyethylene packaging, Tree Chem supports both small-batch research and large-scale production users. For technical support or commercial inquiry, please email rocket@cntreechem.com.

Specification

Basic Information

Technical Specification

Applications

Polymerization Initiator

• Diisobenzoyl Peroxide (DIBP) is widely used as a free-radical initiator for polymerizing vinyl monomers such as styrene, acrylates, and vinyl chloride.
• In polystyrene (PS) polymerization, DIBP provides uniform molecular-weight control and shorter reaction time compared with benzoyl peroxide, producing polymers with excellent clarity and mechanical strength.
• In polyvinyl chloride (PVC) suspension polymerization, DIBP performs effectively between 60 °C and 80 °C, offering a balanced decomposition rate that enhances productivity while minimizing discoloration. The resulting PVC exhibits high purity, toughness, and improved process stability.
• DIBP is also applied in acrylate and methacrylate systems where it initiates polymerization at 50 °C–70 °C, yielding resins with outstanding weatherability, transparency, and adhesion—ideal for coatings and optical-grade applications.

Rubber Crosslinking and Vulcanization

• In the rubber industry, DIBP serves as an efficient crosslinking and curing agent for silicone rubber, EPDM, and polyolefin elastomers.
• For silicone rubber, DIBP initiates vulcanization around 90 °C, promoting uniform crosslinking with minimal gas formation. Silicone products cured with DIBP achieve superior transparency, elasticity, and resistance to yellowing.
• In EPDM and IIR rubbers, DIBP facilitates carbon-carbon crosslinks, significantly improving heat aging resistance, compression set, and chemical stability. These properties make it suitable for high-performance cables, seals, and automotive rubber components.

Unsaturated Polyester Resins and Composites

• DIBP is a preferred initiator for curing unsaturated polyester resins (UPR), used extensively in composite materials, fiberglass, and synthetic marble. It enables efficient low-temperature curing between 60 °C and 100 °C, producing smooth surfaces and enhanced mechanical properties.
• In resin-anchor and adhesive systems, DIBP ensures quick gelation and high bond strength, making it valuable for structural adhesives and reinforced plastics.
• When applied to epoxy composites, DIBP improves crosslink density and adhesion, resulting in durable coatings and encapsulation materials for electrical and electronic devices.

Coatings, Adhesives, and Sealants

• DIBP functions as a curing catalyst in acrylic and polyester coatings, promoting film formation with high gloss and chemical resistance.
• In adhesives and sealants, DIBP enables controlled radical initiation for reactive systems, balancing curing speed and pot life. It is widely used in floor coatings, automotive repaints, and marine finishes, providing strong mechanical integrity and corrosion resistance.

Emerging and High-Tech Applications

• High-purity DIBP grades (≥ 99.9%) are employed in semiconductor resins and electronic encapsulants, where its low ionic residue and clean decomposition profile ensure electrical reliability.
• In energy and advanced materials, DIBP contributes to silicone rubber components for EV battery modules, solar panels, and communication equipment, supporting innovation in high-performance elastomer formulations.

Storage & Handling

• Store in cool, ventilated areas away from heat, sparks, and sunlight.
• Keep containers tightly sealed and avoid contamination.
• Prevent contact with acids, alkalis, reducing agents, and metals.
• Use grounded, non-sparking tools; avoid friction and static discharge.
• Handle under temperature-controlled conditions according to local peroxide storage regulations.

Usage Notice

• Styrene polymerization system: DIBP 0.25 wt% and styrene 99.75 wt%; DIBP acts as a radical initiator at 70 °C, accelerating polymerization and producing high-clarity polystyrene with consistent molecular weight.
• PVC polymerization formulation: DIBP 0.2 wt% and vinyl chloride 99.8 wt%; DIBP enhances polymerization efficiency and reduces thermal degradation for transparent, mechanically strong PVC.
• Acrylate polymerization system: DIBP 0.15 wt% and acrylate monomers 99.85 wt%; DIBP initiates polymerization between 50 °C and 70 °C, yielding resins with high adhesion and weather resistance.
• Silicone rubber vulcanization: DIBP 1.0 phr and silicone base 100 phr; DIBP promotes rapid curing and uniform crosslinking, producing elastic, transparent rubber.
• EPDM rubber formulation: DIBP 1.0 phr with TAIC 0.5 phr; DIBP facilitates carbon–carbon crosslinks to enhance heat stability and chemical resistance.
• UPR resin curing system: DIBP 0.3 wt% and unsaturated polyester resin 99.7 wt%; DIBP provides low-temperature curing and excellent surface gloss for composites.
• Epoxy adhesive system: DIBP 0.25 wt% and epoxy resin 99.75 wt%; DIBP increases crosslink density and bond strength for structural applications.
• Electronic encapsulant formulation: DIBP 0.2 wt% and epoxy 99.8 wt%; DIBP ensures low ionic impurities and superior thermal stability for microelectronic components.

Packaging

• 20 kg polyethylene drums
• Custom packaging available on request