2,4-디클로로벤조일 퍼옥사이드 2,4-DCBP CAS 133-14-2

Tree Chem manufactures and supplies 2,4-Dichlorobenzoyl Peroxide with tight control of assay, moisture/whiteness, and trace metal content to support polymerization and crosslinking applications. Both powder and paste grades are produced under strict safety and quality systems for stable reactivity and smooth dispersion in resin systems.

Our technical team can help you select between powder or paste based on your equipment and cure profile (mixing energy, temperature, and dosing accuracy). For quotations or technical support, please contact rocket@cntreechem.com.

사양

기본 정보

기술 사양

응용 프로그램

Polymerization Initiator

• 2,4-Dichlorobenzoyl Peroxide (DCBP) serves as an efficient free-radical initiator in the polymerization of vinyl monomers such as styrene, vinyl chloride, and acrylates. Its unique chlorine-substituted aromatic structure lowers the activation temperature to approximately 45 °C, allowing energy-efficient polymerization under mild conditions.
• In polystyrene (PS) polymerization, DCBP enables higher molecular weights and narrower molecular weight distribution compared with benzoyl peroxide, reducing reaction time by up to 30%. It is particularly effective for producing high-impact and general-purpose PS.
• In PVC suspension polymerization, DCBP operates between 60–80 °C, enhancing polymerization rate by 15–20% over conventional initiators. The resulting PVC exhibits improved clarity and mechanical strength, ideal for pipes, profiles, and films.
• For acrylate systems, DCBP effectively initiates polymerization within 60–90 °C, yielding polymers with superior weatherability and optical properties. It is also applied in the curing of unsaturated polyester resins (UPR) for composite materials, fiberglass, and architectural panels, reducing curing time by more than 80% compared with benzoyl peroxide.

Rubber Vulcanization

• DCBP is widely applied as a vulcanizing and crosslinking agent in silicone rubber and specialty elastomers due to its low decomposition temperature and rapid crosslinking kinetics.
• In silicone rubber, DCBP begins vulcanization at as low as 90 °C, significantly lower than traditional peroxides such as DCP. This makes it ideal for extrusion molding and continuous hot-air curing. Silicone products cured with DCBP demonstrate high transparency, smooth surfaces, and uniform elasticity, meeting FDA and RoHS safety requirements.
• It is also applicable to EPDM, IIR, and fluororubber, where DCBP promotes carbon–carbon crosslinks rather than sulfur bridges, improving heat resistance, aging stability, and chemical inertness. Its decomposition produces minimal volatiles, ensuring smooth extrusion without bubble formation—an advantage for cable insulation, seals, and medical-grade silicone components.

Adhesives, Resins, and Composites

• DCBP functions as a low-temperature initiator and curing agent for various adhesives, coatings, and composite materials. In polyester resin anchor systems, it offers rapid low-temperature curing, achieving gelation within 15 minutes and full strength within four hours, suitable for tunnel and mining reinforcement.
• In composite materials, DCBP improves crosslinking efficiency and mechanical strength of FRP (fiber-reinforced plastics), as well as electrical insulation performance in epoxy systems. It is also used as a catalyst in coating formulations and sealants, enabling high-performance, heat-resistant adhesives and encapsulants for electronic components.

Pharmaceutical and Chemical Intermediates

• As a derivative of 2,4-dichlorobenzoyl chloride, DCBP participates in the synthesis of agrochemicals, dyes, and pharmaceutical intermediates, particularly for cephalosporin antibiotics. It also aids in the functionalization of peptides and in forming drug carrier materials such as cyclodextrin nanosponges, enhancing controlled-release properties.

Emerging and High-Tech Applications

• High-purity DCBP (≥ 99.99%) is expanding into semiconductor encapsulation and electronic-grade resins, where it serves as a clean initiator producing no ionic residues. Its controlled decomposition and low metal contamination (< 10 ppb) make it suitable for high-reliability microelectronic packaging.
• In new energy sectors, DCBP is applied in silicone rubber components for EV batteries, 5G communication systems, and solar modules, contributing to global growth in advanced materials manufacturing.

보관 및 취급

• Store in original closed PE drums in a cool, dry, well-ventilated area away from heat and sunlight.
• Keep separate from reducing agents, acids/alkalis, metals and accelerators; avoid contamination.
• Use clean, dry, grounded tools and equipment; prevent friction, impact and static discharge.
• Handle at recommended temperatures; follow local regulations for organic peroxides (temperature control during transport and storage).
• Refer to the SDS for detailed safety, first-aid, and disposal guidance.

사용 공지

• Avoid mixing with incompatible substances.
• Handle under controlled temperature conditions.
• Use personal protective equipment (gloves, goggles, and protective clothing).
• In case of leakage, collect with inert absorbent and rinse with water.
• Dispose of according to hazardous waste regulations.
• Styrene polymerization system: 2,4-Dichlorobenzoyl Peroxide 0.3 wt% and styrene 99.7 wt%; DCBP acts as an initiator at 70 °C, accelerating polymerization and improving molecular weight distribution for high-impact polystyrene production.
• PVC suspension polymerization: 2,4-Dichlorobenzoyl Peroxide 0.2 wt% and vinyl chloride 99.8 wt%; DCBP enhances polymerization rate by about 20%, yielding PVC with superior transparency and mechanical strength.
• Acrylate polymerization: 2,4-Dichlorobenzoyl Peroxide 0.15 wt% and acrylate monomers 99.85 wt%; DCBP initiates polymerization between 60 °C and 90 °C, resulting in weather-resistant and optically clear polymers.
• Silicone rubber vulcanization: DCBP 1.2 phr with 100 phr silicone base; it initiates vulcanization above 90 °C, providing rapid crosslinking and excellent transparency in cured silicone.
• EPDM rubber formulation: DCBP 1.0 phr combined with TAIC 0.5 phr; DCBP facilitates carbon–carbon crosslinking to enhance heat resistance and chemical durability of elastomers.
• Resin anchor adhesive formulation: DCBP 0.5 wt% with unsaturated polyester resin 99.5 wt%; DCBP enables rapid curing at low temperatures, achieving gelation within 15 minutes and full strength in several hours.
• Composite resin curing system: DCBP 0.3 wt% with epoxy resin 99.7 wt%; DCBP improves crosslink density and bonding strength for structural and electronic applications.
• Electronic-grade encapsulant: DCBP 0.2 wt% with epoxy 99.8 wt%; DCBP ensures high purity, low ionic residue, and excellent thermal stability required in semiconductor encapsulation processes.

포장

• 15 kg / 30 kg PE drums; custom packaging available on request.